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The role of crystallographic orientation on the forces generated in ultra-precision grinding of anisotropic materials such as monocrystalline silicon, Marsh, Couey, Vallance, Yi (2007) |
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Micro-machining and micro-grinding with tools fabricated by micro electro-discharge machining, Morgan, Vallance, Marsh (2007) |
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Specific grinding energy while microgrinding tungsten carbide with polycrystalline diamond micro tools, Morgan, Vallance, and Marsh (2007) |
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Precision instrumented grinding summary, Jeremiah Couey and Dave Arneson (2005) |
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Monitoring force in precision cylindrical grinding, ASPE Journal of Precision Engineering, vol 29, no 3, pp 307-314, Couey, Marsh, Knapp and Vallance (2005) |
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In-process force monitoring for precision grinding semiconductor silicon wafers, Accepted for publication, Couey, Marsh, Knapp and Vallance (2005) |
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Micro tool characterization using scanning white light interferometry, Journal of Micromechanics and Mmicroengineering, vol 8, pp 1234-1243, Vallance, Morgan, Shreve and Marsh (2004) |
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Micro machining glass with polycrystalline diamond tools shaped by micro electro discharge machining, Journal of Micromechanics and Microengineering, vol 14, pp 1687-1692, Morgan, Vallance and Marsh (2004) |
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Results from grinding brittle materials with an instrumented spindle, Byron Knapp (1999) |
